LINEAR TECHNOLOGY MATERIALS DECLARATION

LTC2955CDDB-1#TRMPBF (Engineering Calculation) DFN 3mm X 2mm Exp. Pad  
(printed on: 2020-02-27 00:03:32) TOTAL MASS (g): 0.013674
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.000544 1000000 39784.6757812
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.005090 975000 372250.03125
Iron (Fe) 7439-89-6 0.000125 24000 9141.70019531
Phosphorus (P) 7723-14-0 0.000002 300 146.267196655
Zinc (Zn) 7440-66-6 0.000004 700 292.534393311
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.005221 1000000 381830.5
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.000185 1000000 13500.9375
External Plating Total: 0.000185 1000000 13500.9375
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000103 1000000 7532.76074219
Internal Plating Total: 0.000103 1000000 7532.76074219
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000169 800000 12359.578125
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000042 200000 3071.61108398
Die Attach Total: 0.000211 1000000 15431.1894531
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.000958 130000 70061.9921875
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.006338 860000 463520.71875
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000074 10000 5411.88623047
Encapsulation Total: 0.007370 1000000 538994.625
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000040 1000000 2925.34375
  TOTAL MASS (g): 0.013674