LINEAR TECHNOLOGY MATERIALS DECLARATION

LTC3406ABES5#TRMPBF (Engineering Calculation) TSOT-23  
(printed on: 2020-04-04 13:18:43) TOTAL MASS (g): 0.012455
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.000549 1000000 44077.8515625
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.004485 975000 360089.53125
Iron (Fe) 7439-89-6 0.000110 24000 8831.62792969
Phosphorus (P) 7723-14-0 0.000001 300 80.2875213623
Zinc (Zn) 7440-66-6 0.000003 700 240.862594604
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.004599 1000000 369242.3125
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.000635 1000000 51001.5
External Plating Total: 0.000635 1000000 51001.5
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000080 1000000 6423.00146484
Internal Plating Total: 0.000080 1000000 6423.00146484
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000403 750000 32355.875
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000134 250000 10758.5283203
Die Attach Total: 0.000537 1000000 43114.4023438
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.000775 130000 62222.8359375
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.004947 830000 397182.40625
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000209 35000 16780.09375
Carbon Black (C) 1333-86-4 0.000030 5000 2408.62548828
Encapsulation Total: 0.005961 1000000 478593.9375
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000094 1000000 7547.02734375
  TOTAL MASS (g): 0.012455